INDUSTRIAL VISION
Evaluate dedicated stations by part, visibility and process. These guides do not imply that standard PCBA AOI machines cover every industry.
Wafers, bare dies, micro-bumps and package interiors are different inspection targets. Optical imaging can be evaluated for exposed particles, chipped edges and bumps; internal voids and delamination may require X-ray, acoustic or other suitable methods. PCBA AOI specifications do not automatically qualify wafer or advanced-packaging inspection.
→Bead inspection can assess visible continuity, width, position and surface height. Images of opaque adhesive cannot directly verify internal bubbles, bond strength or leak-tightness. Quality inspection and robot dispensing-path correction are separate integration tasks; path correction needs calibration, control interfaces and process validation.
→Optical tab-weld inspection targets visible burrs, displacement, surface burns and weld appearance. Internal lack of fusion, connection strength and resistance cannot be established from surface shape alone; suitable nondestructive, mechanical or electrical tests are needed.
→Continuous electrodes and winding processes need imaging designed around web speed, width, reflectivity and visible edges. Optical inspection can assess exposed coating defects and edge position; alignment concealed by winding or packaging requires another inspection method.
→2D and 3D optical inspection can evaluate exposed pores, pits and contour anomalies. Internal porosity, inclusions and material soundness require X-ray, CT or another validated method. A 3D camera cannot see through metal.
→Packaging vision can assess visible wrinkles, trapped material, seal position, missing items and printed codes. Acceptable appearance does not establish leak-tightness or seal strength; those properties need appropriate tests.
→Print inspection separates OCR reading, OCV content checks, colour registration and appearance defects. Colour, substrate reflections and font changes affect imaging. Continuous film and individual packages need different triggers and transport designs.
→Food vision stations can assess visible appearance, colour, shape and exposed foreign material. Optical images do not guarantee detection of hidden internal contaminants or replace microbiological, composition or other quality tests. Grading, rejection and robot picking are separate functions.
→Capsule appearance inspection covers visible damage, deformation, colour and markings. Images do not establish contents, composition, sterility or efficacy. Multi-view coverage, stable presentation and cleaning requirements determine the station design.
→Glass inspection depends on transmission, reflection, background and coatings. Particles, scratches and cracks require material-specific lighting. Reflections should not automatically be labelled defects, and one surface view does not guarantee coverage of internal inclusions.
→Continuous surface inspection must account for width, speed, tension, texture and illumination. Suitable imaging can assess stains, scratches and visible pinholes; an optical anomaly does not directly establish thickness, mechanical or barrier performance.
→Assembly inspection can verify visible part presence, orientation, placement and surface condition. Images do not directly prove internal connections, tightening torque or function. Robot picking supports handling and must not be presented as an AOI inspection capability or accuracy specification.
→Provide board dimensions, component heights, target defects, cycle time and inline or offline requirements. We evaluate visibility, imaging and acceptance criteria with your production samples.
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