Wafers, bare dies, micro-bumps and package interiors are different inspection targets. Optical imaging can be evaluated for exposed particles, chipped edges and bumps; internal voids and delamination may require X-ray, acoustic or other suitable methods. PCBA AOI specifications do not automatically qualify wafer or advanced-packaging inspection.
How to validate
Supply dimensions, minimum defect sizes, tolerances, surface materials, cleanliness needs and handling requirements. Qualify lateral resolution, height repeatability, edge visibility and throughput before selecting dedicated equipment or an integration design.
This is a general industrial-vision evaluation guide, not a delivered IRIS ANT PCBA AOI case study or a standard machine configuration. The station must be qualified for the parts, optics and automation requirements.
Project evaluation checklist
- Define the item, visible inspection surfaces and minimum defects; separate appearance, internal structure and electrical or functional checks.
- Prepare verified good, defective and borderline samples across lots; separate training and acceptance sets.
- Report escapes and false calls by defect class, with review workload, complete cycle time and repeatability.
- Confirm program versions, permissions, retention and traceability fields; approve production only after trials pass.
Continue with
Industrial vision applications
Evaluate a dedicated station around the part and process.
→PCBA AOI products
Machines and software for board inspection.
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