P1 / P2
- 5MP(15µm) / 12MP(10µm)
- Max board 470 × 330 mm
- Manual load/unload
- High-mix low-volume / prototyping
Inspection · 2D AI AOI Equipment · 2D EQUIPMENT
P-Serieshigh-speed 2D optical inspection.
DaoAI P-Series 2D AI-AOI equipment — telecentric lens + multispectral RGB 6-channelimaging, full coverage from offline P1/P2 to inline P3. Powered by AI AOI Software, one sample live in 5 minutes.
20MPTelecentric lens (10µm)
500×325mmMax board size
Offline + inlineP1 / P2 / P3 full coverage
6channelsMultispectral RGB coaxial lighting
99%+detection accuracy
5minSample-based programming & go-live
P3
- 20MP(10µm) telecentric lens
- Max board 500 × 325 mm
- Single-track conveyor · inline SMT
- High-volume SMT inspection
SAI2D-500
- 2D assembly-presence inspection
- Multi-part inspection <1s
- Mis/missing parts / positional deviation
- Wrong-part / reverse detection
2D defect types · 2D DEFECTS
Missing / wrong partTombstonePolarity / flipSolder bridgeOffset / shiftInsufficient solderOCR charactersForeign objectReversed / wrong orientationContamination / debris
Model specs · 2D P-Series SPECS
| Spec | P1 / P2 | P3 |
|---|---|---|
| Form | Offline | Inline · single track |
| Camera / resolution | 5MP(15µm) / 12MP(10µm) | 20MP(10µm) |
| Max board size | 470 × 330 mm | 500 × 325 mm |
| Load/unload | Manual | Single-track conveyor |
| Best for | High-mix / low-volume | High-volume SMT |
Common specs · telecentric lens · multispectral RGB 6-channel / high-intensity coaxial lighting · board thickness 0.5–5mm · positioning ±3mm · powered by AI AOI Software
APPLICATIONS
SMT, DIP solder-joint and component-placement inspection.
Device appearance and OCR character inspection.
Keycap, plastic-housing appearance and assembly inspection.
High-precision packaging-integrity and appearance inspection.