S1-500D
- Synchronized 2D+3D inspection
- 30-second modeling from one sample
- Zero escape · 99%+ accuracy
- Inline SMT system
Inspection · 3D AI AOI Equipment · 3D EQUIPMENT
2D+3D in syncmicron-level 3D inspection.
DaoAI 3D AI-AOI Equipment — 2D appearance + 3D height / coplanarityin synchronized inspection. The flagship S1-500D models from one good sample in 30 seconds — zero escape, 99%+ accuracy, powered by the AI AOI software system.
SOVEREIGN AI VALUE
Your process know-how never leaves your line.
Yield curves, defect signatures, process parameters — this is a factory's core trade secret. Under IDC's framework, 3D AI AOI hardware starts with data sovereignty: fully on-prem deployment, with point-cloud data, results and model weights never leaving your site or training any third-party model.
- Process parameters stay yours
Good-sample templates and defect libraries are decades of production know-how — we help you use it, never help anyone else learn it.
- <12ms edge inference, works offline
Core inspection logic runs on the line itself, independent of external networks or cloud availability.
- A model that only gets smarter for you
Line feedback keeps refining your own private model — the edge you build stays yours, not a shared foundation.
FLAGSHIP · S1-500D
DaoAI S1-500D · Inline SMT AOI
View details
Zero escape · synchronized 2D+3D · 30-second modeling from one sample · 99%+ accuracy
2D+3DIn syncAppearance + height in one inspection
30sModel from one good sample
0missed escapesNo critical defect slips through
99%+detection accuracy
µm-level3D height precision
InlineSMTInline-cadence inspection
P3D
- 20MP(10µm) + 3D
- Max board 500 × 325 mm
- Dual-track conveyor · dual-line parallel
- High-volume 2D+3D inspection
SAI3D-470
- Synchronized 2D + 3D
- Multi-part < 1s · 99.97% detection
- Assembly height / coplanarity
- Mis/missing parts / positional deviation
3D Defect Types · 3D DEFECTS
TombstoneLifted LeadCoplanarityInsufficient solderExcess solderHeight deviationBGA void3D misalignmentComponent float heightWarpage
Model Specs · 3D Series SPECS
| Spec | S1-500D | P3D | SAI3D-470 |
|---|---|---|---|
| Form | Inline · all-in-one system | Inline · dual track | Assembly inspection |
| Inspection dimensions | 2D + 3D in sync | 2D + 3D | 2D + 3D |
| Modeling | One good sample · 30s | Sample-based modeling | Sample-based modeling |
| Max board size | 500 × 325 mm | 500 × 325 mm | 470 × 330 mm |
| Best for | Inline SMT full-board | High-volume dual-line | Assembly / multi-part inspection |
Common specs · 3D height imaging · multispectral RGB / coaxial lighting · micron-level 3D precision · powered by the AI AOI software system · 100% on-premise
APPLICATIONS
3D solder volume, coplanarity, tombstone and lift inspection of solder joints.
BGA / CSP voids, ball height and coplanarity.
Zero-escape high-reliability soldering and 3D dimensions.
3D verification of assembly height, clearance and positional deviation.
FAQ
What is the accuracy of the 2D+3D synchronous micron-level 3D detection of DaoAI?
DaoAI's detection has micron-level 3D height accuracy. The flagship S1-500D achieves 0 missed detections and an accuracy rate of over 99%. The assembly model SAI3D -470 has a detection rate of 99.97%, accurately detecting various defects.
What scenarios are suitable for this set of detection products?
It is suitable for multiple industries, such as 3D solder volume detection of high-end PCBA solder joints, relevant detection of BGA/CSP in semiconductor packaging, high-reliability welding detection in automotive electronics, and 3D verification of precision assembly.
How to deploy DaoAI's detection equipment?
DaoAI's detection equipment adopts 100% local deployment, equipped with an AI AOI software system. It can ensure data security and stable operation, providing reliable industrial quality inspection solutions for enterprises.
The Q&A above was generated with AI assistance and is for reference only; official specifications and commitments are subject to direct consultation.