S1-500D
- Synchronized 2D+3D inspection
- 30-second modeling from one sample
- Zero escape · 99%+ accuracy
- Inline SMT system
Inspection · 3D AI AOI Equipment · 3D EQUIPMENT
2D+3D in syncmicron-level 3D inspection.
DaoAI 3D AI-AOI Equipment — 2D appearance + 3D height / coplanarityin synchronized inspection. The flagship S1-500D models from one good sample in 30 seconds — zero escape, 99%+ accuracy, powered by the AI AOI software system.
FLAGSHIP · S1-500D
DaoAI S1-500D · Inline SMT AOI
View details
Zero escape · synchronized 2D+3D · 30-second modeling from one sample · 99%+ accuracy
2D+3DIn syncAppearance + height in one inspection
30sModel from one good sample
0missed escapesNo critical defect slips through
99%+detection accuracy
µm-level3D height precision
InlineSMTInline-cadence inspection
P3D
- 20MP(10µm) + 3D
- Max board 500 × 325 mm
- Dual-track conveyor · dual-line parallel
- High-volume 2D+3D inspection
SAI3D-470
- Synchronized 2D + 3D
- Multi-part < 1s · 99.97% detection
- Assembly height / coplanarity
- Mis/missing parts / positional deviation
3D Defect Types · 3D DEFECTS
TombstoneLifted LeadCoplanarityInsufficient solderExcess solderHeight deviationBGA void3D misalignmentComponent float heightWarpage
Model Specs · 3D Series SPECS
| Spec | S1-500D | P3D | SAI3D-470 |
|---|---|---|---|
| Form | Inline · all-in-one system | Inline · dual track | Assembly inspection |
| Inspection dimensions | 2D + 3D in sync | 2D + 3D | 2D + 3D |
| Modeling | One good sample · 30s | Sample-based modeling | Sample-based modeling |
| Max board size | 500 × 325 mm | 500 × 325 mm | 470 × 330 mm |
| Best for | Inline SMT full-board | High-volume dual-line | Assembly / multi-part inspection |
Common specs · 3D height imaging · multispectral RGB / coaxial lighting · micron-level 3D precision · powered by the AI AOI software system · 100% on-premise
APPLICATIONS
3D solder volume, coplanarity, tombstone and lift inspection of solder joints.
BGA / CSP voids, ball height and coplanarity.
Zero-escape high-reliability soldering and 3D dimensions.
3D verification of assembly height, clearance and positional deviation.