Inspection Coverage
16 inspection capabilities. Here’s what they cover.
The DaoAI ACI OS — Each inspection runs on an automatically generated inspection program. Select the applicable checks for each component package type.
Inspection coverage lists the defect classes DaoAI's (微链道爱) ACI OS decides on PCBA — missing, wrong, reversed, offset, bridging, poor wetting, tombstoning, solder balls, foreign objects and more — each running on the auto-generated program and selected per package type. Its boundary with a generic "capability list" is that every item here links to how it is decided, not just a feature name.
| Component Presence & Identification | Missing or incorrect components. |
| Placement, Orientation & Polarity | X/Y offset, skew or rotation, incorrect polarity, tombstoning, billboarding, and upside-down placement. |
Shift
Misalignment
Polarity
Tombstone
| Component Condition | Package or body damage, damaged chip terminations, burn marks, and discoloration. |
| Component Height & Coplanarity | Measures component height and detects lifted or tilted component bodies and coplanarity defects using 3D AOI. |
Height in 3D
| Solder Joint Quality | Insufficient solder, excess solder, and cold solder joints. |
Insufficient solder
| Open Solder Joints | Open or unsoldered connections, available in both 2D and 3D configurations. |
NG · open joint
| Lead Condition | Lifted, bent, damaged, missing, or unsoldered component leads. |
| Solder Bridging | Unintended solder connections between adjacent pads or leads. |
Bridge
| Adhesive Contamination on Pads | Unwanted SMT adhesive (“red glue”) on solder pads. |
| OCR / OCV | Reads and verifies alphanumeric component markings, symbols, and laser-marked text. |
| Barcode & Serial Number Reading | Reads 1D barcodes, QR codes, and serial numbers for unit-level traceability. |
| Through-Hole Lead & Solder Joint Inspection | Pre-wave: lead/pin presence and insertion. Post-wave: missing, insufficient, or excess solder. |
Pre-wave · NG
Pre-wave · OK
Post-wave · NG
| Through-Hole Solder Bridging | Solder bridges between adjacent through-hole pads. |
| Solder Balls & Particles | Solder balls or particles anywhere on the assembly, not only adjacent to a solder joint. |
Solder ball
Solder ball, on a pad
| Foreign Object Debris (FOD) | Debris, wire clippings, dropped components, and other foreign material. |
| Surface Contamination | Unacceptable flux residue, stains, or other surface contamination. Coming soon. |
Bring us the defect your current inspection misses.
Spend 30 minutes with one of our engineers. If it’s listed above, we’ll show the system detecting it on your board. To put your own line's numbers against the spend, see how to calculate AOI machine cost and ROI.