Inspection Coverage

16 inspection capabilities. Here’s what they cover.

Each inspection runs on an automatically generated inspection program. Select the applicable checks for each component package type.

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Component inspection01
Component Presence & IdentificationMissing or incorrect components.
AOI defect example: Missing part (Component Presence & Identification)
Missing part02
Placement, Orientation & PolarityX/Y offset, skew or rotation, incorrect polarity, tombstoning, billboarding, and upside-down placement.
AOI defect example: Shift (Placement, Orientation & Polarity)

Shift

AOI defect example: Misalignment (Placement, Orientation & Polarity)

Misalignment

AOI defect example: Polarity (Placement, Orientation & Polarity)

Polarity

AOI defect example: Tombstone (Placement, Orientation & Polarity)

Tombstone

AOI defect example: Flipped (Placement, Orientation & Polarity)
Flipped03
Component ConditionPackage or body damage, damaged chip terminations, burn marks, and discoloration.
AOI defect example: Damage (Component Condition)
Damage04
Component Height & CoplanarityMeasures component height and detects lifted or tilted component bodies and coplanarity defects using 3D AOI.
AOI defect example: Height in 3D (Component Height & Coplanarity)

Height in 3D

AOI defect example: Pins in 3D (Component Height & Coplanarity)
Pins in 3DSolder joint & lead inspection05
Solder Joint QualityInsufficient solder, excess solder, and cold solder joints.
AOI defect example: Insufficient solder (Solder Joint Quality)

Insufficient solder

AOI defect example: Excess solder (Solder Joint Quality)
Excess solder06
Open Solder JointsOpen or unsoldered connections, available in both 2D and 3D configurations.
AOI defect example: NG · open joint (Open Solder Joints)

NG · open joint

AOI example judged OK: OK (Open Solder Joints)
OK07
Lead ConditionLifted, bent, damaged, missing, or unsoldered component leads.
AOI defect example: Lifted lead (Lead Condition)
Lifted lead08
Solder BridgingUnintended solder connections between adjacent pads or leads.
AOI defect example: Bridge (Solder Bridging)

Bridge

AOI defect example: Bridge, QFP (Solder Bridging)
Bridge, QFP09
Adhesive Contamination on PadsUnwanted SMT adhesive (“red glue”) on solder pads.
AOI defect example: Red glue process (Adhesive Contamination on Pads)
Red glue processMarking & code inspection10
OCR / OCVReads and verifies alphanumeric component markings, symbols, and laser-marked text.
AOI defect example: OCR (OCR / OCV)
OCR11
Barcode & Serial Number ReadingReads 1D barcodes, QR codes, and serial numbers for unit-level traceability.
AOI defect example: QR code (Barcode & Serial Number Reading)
QR codeThrough-hole inspection12
Through-Hole Lead & Solder Joint InspectionPre-wave: lead/pin presence and insertion. Post-wave: missing, insufficient, or excess solder.
AOI defect example: Pre-wave · NG (Through-Hole Lead & Solder Joint Inspection)

Pre-wave · NG

AOI example judged OK: Pre-wave · OK (Through-Hole Lead & Solder Joint Inspection)

Pre-wave · OK

AOI defect example: Post-wave · NG (Through-Hole Lead & Solder Joint Inspection)

Post-wave · NG

AOI example judged OK: Post-wave · OK (Through-Hole Lead & Solder Joint Inspection)
Post-wave · OK13
Through-Hole Solder BridgingSolder bridges between adjacent through-hole pads.
AOI defect example: Bridge (Through-Hole Solder Bridging)
BridgeWhole-board inspection14
Solder Balls & ParticlesSolder balls or particles anywhere on the assembly, not only adjacent to a solder joint.
AOI defect example: Solder ball (Solder Balls & Particles)

Solder ball

AOI defect example: Solder ball, on a pad (Solder Balls & Particles)

Solder ball, on a pad

AOI defect example: Solder ball, close-up (Solder Balls & Particles)
Solder ball, close-up15
Foreign Object Debris (FOD)Debris, wire clippings, dropped components, and other foreign material.
AOI defect example: Foreign object (Foreign Object Debris (FOD))
Foreign object16
Surface ContaminationUnacceptable flux residue, stains, or other surface contamination. Coming soon.

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