PCBA · AOI GUIDES

PCBA AOI application guides

Guides organised by board defects, imaging conditions and acceptance methods, with inspection kept distinct from robot handling.

PCBA AOI application guides

BGA / QFN: AOI and X-ray inspection boundaries

2D and 3D AOI inspect optically visible appearance, placement and surface height. Solder joints hidden beneath packages, internal solder voids and concealed bridges require a suitable X-ray, AXI or CT inspection method. Optical 3D reconstruction cannot see through a package. A visible QFN side fillet does not establish the condition of its underside pad.

SMT solder joints: visible defects and review

Post-reflow AOI checks visible solder bridges, insufficient solder, displaced components, tombstones and lead anomalies. 2D inspection evaluates appearance; 3D adds surface-height measurements. Surface images alone cannot certify internal joint structure, wetting or electrical connectivity.

PCBA components: presence, identity and polarity

Component inspection covers presence, placement, orientation, visible markings and body damage. Polarity decisions need a visible mark or geometric feature. Parts with identical appearance and markings cannot be distinguished by electrical value using AOI alone.

Lead height and coplanarity: evaluating 3D AOI

3D AOI measures visible surface heights to assess lifted leads, raised components and relative coplanarity. Results depend on the reference plane, reflectivity, occlusion and calibration. A picking pose from a robot camera is a different output from an AOI defect decision.

Gold fingers: surface scratches and contamination

Gold-finger inspection targets visible scratches, foreign material, contamination and unusual colour. Directional reflections from plating require controlled lighting, viewing angles and board positioning. Colour changes can flag review but do not establish plating composition or contact resistance.

PCBA markings and codes: OCR / OCV

OCR reads visible characters, OCV compares them with expected text, and code reading supports board and lot traceability. Missing, blurred, shifted and low-contrast markings must be evaluated with actual fonts, illumination and resolution.

Choose with actual production samples

Provide board dimensions, component heights, target defects, cycle time and inline or offline requirements. We evaluate visibility, imaging and acceptance criteria with your production samples.

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