PCBA · AOI GUIDE

Lead height and coplanarity: evaluating 3D AOI

3D AOI measures visible surface heights to assess lifted leads, raised components and relative coplanarity. Results depend on the reference plane, reflectivity, occlusion and calibration. A picking pose from a robot camera is a different output from an AOI defect decision.

Application and selection guide

3D AOI measures visible surface heights to assess lifted leads, raised components and relative coplanarity. Results depend on the reference plane, reflectivity, occlusion and calibration. A picking pose from a robot camera is a different output from an AOI defect decision.

How to validate

Define datums and tolerances, then test tall-component shadows, board warpage and reflective finishes. Use reference artefacts and repeated measurements to assess repeatability, followed by production-board trials. Diced chips and bare dies need a separately qualified imaging and handling setup.

Project evaluation checklist

  1. Define the item, visible inspection surfaces and minimum defects; separate appearance, internal structure and electrical or functional checks.
  2. Prepare verified good, defective and borderline samples across lots; separate training and acceptance sets.
  3. Report escapes and false calls by defect class, with review workload, complete cycle time and repeatability.
  4. Confirm program versions, permissions, retention and traceability fields; approve production only after trials pass.

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