Post-reflow AOI checks visible solder bridges, insufficient solder, displaced components, tombstones and lead anomalies. 2D inspection evaluates appearance; 3D adds surface-height measurements. Surface images alone cannot certify internal joint structure, wetting or electrical connectivity.
How to validate
Use verified good, defective and borderline boards across reflections, warpage and production lots. Fix acceptance criteria before measuring escapes, false calls, review time and complete board cycle time. Release a program version only after review.
Project evaluation checklist
- Define the item, visible inspection surfaces and minimum defects; separate appearance, internal structure and electrical or functional checks.
- Prepare verified good, defective and borderline samples across lots; separate training and acceptance sets.
- Report escapes and false calls by defect class, with review workload, complete cycle time and repeatability.
- Confirm program versions, permissions, retention and traceability fields; approve production only after trials pass.
Continue with
2D AOI machines
Visible appearance, components and markings.
→3D AOI machines
Visible surface height and coplanarity.
→AOI software
Programming, review, model management and traceability.
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