Semiconductor / Chips · APPLICATION SCENARIO

Post-Wire-Bond Inspection

Wire bond quality directly affects chip electrical connection reliability and heat dissipation.

Scenario · Wire Bonding / Gold Wire Inspection

Post-Wire-Bond Inspection

Challenge & Solution

Post-Wire-Bond Inspection

ChallengeProlonged manual visual inspection leads to operator fatigue, with missed-detection rates for subtle arc-height, direction, and connection anomalies reaching 20%–30%.

SolutionThe defect model is pushed down to the AI-AOI edge device, rigorously checking arc height, direction, and connection state wire by wire.

98%Detection accuracy
Throughput increase
→0Critical-defect escape rate
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Recommended equipment: 3D AI AOI · AOI Software

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This article was generated by AI. Customer cases are simulated scenarios based on real product capabilities and figures are illustrative; see product pages for official benchmarks.