Semiconductor / Chips · APPLICATION SCENARIO

Wafer Surface Particle & Scratch Classification

During packaging, particles and scratches on the wafer surface vary widely in form — a frequent source of yield-affecting defects.

Scenario · Wafer Surface: Scratches / Particles / Chipping

Wafer Surface Particle & Scratch Classification

Challenge & Solution

Wafer Surface Particle & Scratch Classification

ChallengeTraditional inspection missed up to 3% of defects with a 20% false-positive rate, and every changeover required 30+ minutes of manual tuning.

SolutionVision foundation model plus APDT positive/few-shot learning: 1–20 good samples enable zero-code modeling in 5 minutes.

99.2%Detection rate
-85%False positive rate
<0.8%Missed detection rate
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This article was generated by AI. Customer cases are simulated scenarios based on real product capabilities and figures are illustrative; see product pages for official benchmarks.