Semiconductor / Chips · APPLICATION SCENARIO

Die Attach Void Detection

Voids from the die-attach process affect a chip's heat dissipation and electrical performance — a key risk point for packaging reliability.

Scenario · Die Attach Shift

Die Attach Void Detection

Challenge & Solution

Die Attach Void Detection

ChallengeTraditional inspection missed about 3% of defects with a false-positive rate as high as 20%, and manual re-judgment was inefficient.

SolutionAPDT positive-sample learning needs only 1–20 good samples to identify voids, with support for 100% on-premise deployment.

98%+Void detection rate

-70%False positive rate

<2%Missed detection rate

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This article was generated by AI. Customer cases are simulated scenarios based on real product capabilities and figures are illustrative; see product pages for official benchmarks.