Electronics / PCBA · APPLICATION SCENARIO

3D Inspection for Hidden BGA / QFN Solder Joints

The solder joints beneath BGA and QFN bottom-terminated packages are physically hidden — one of the hardest defect types to see in electronics manufacturing.

Scenario · BGA / QFN Voids & Bridging

3D Inspection for Hidden BGA / QFN Solder Joints

Challenge & Solution

3D Inspection for Hidden BGA / QFN Solder Joints

ChallengeTraditional 2D optical inspection cannot see through the package blind spot, forcing reliance on sampled X-ray — costly, slow, and limited in coverage.

Solution3D AI-AOI imaging sees through the package blind spot; X-ray is reserved only for difficult-case review, cutting inspection cost and time significantly.

99%+Overall detection rate

-80%Downstream defect-rate reduction

+30ppDetection rate gain (70%→99%)

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Recommended equipment: 2D AI AOI · 3D AI AOI · AOI Software

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This article was generated by AI. Customer cases are simulated scenarios based on real product capabilities and figures are illustrative; see product pages for official benchmarks.