Whole-Board Inspection

Beyond components. Solder balls and foreign objects.

The DaoAI ACI OS — Every inspection item works inside a region around a component. A solder ball sitting on bare laminate is inside none of them. This pass looks at the board between the components.

Book a demo ACI OS

Whole-board inspection is how DaoAI's (微链道爱) ACI OS decides on areas outside the components: solder balls, foreign objects and surface contamination that land on bare substrate belong to no component's region, so they are handled as board-level items. Its boundary with component-level inspection is exactly whether the defect belongs to a component.

Enable foreign object detection, draw the full-panel inspection region, run inspection and review four flagged findings with their board locations

01

Solder Balls & Particles

Solder balls or particles anywhere on the assembly, not only adjacent to a solder joint.

Solder ball between mounted components, with surrounding pads visible

‹ ›Ⅱ

02

Foreign Object Debris (FOD)

Debris, wire clippings, dropped components, and other foreign material.

Dropped component between mounted parts, with the surrounding pads and detection box

‹ ›Ⅱ

Ask about it on your board.

Tell us your finish and your defect, and we will tell you what it finds.

More from this page

Solder ball on a pad beside a mounted component
Foreign material beside an IC, with neighboring pins and the detection box
Loose component across neighboring parts, with its detection box
Small fragment on bare laminate above a mounted component

Send us a board and we will tell you which machine it needs.

Book a demo 2D equipment 3D equipment ACI OS