Whole-Board Inspection

Beyond components. Solder balls and foreign objects.

Every inspection item works inside a region around a component. A solder ball sitting on bare laminate is inside none of them. This pass looks at the board between the components.

Book a demo AI AOI software
Enable foreign object detection, draw the full-panel inspection region, run inspection and review four flagged findings with their board locations

01

Solder Balls & Particles

Solder balls or particles anywhere on the assembly, not only adjacent to a solder joint.

Solder ball between mounted components, with surrounding pads visible

02

Foreign Object Debris (FOD)

Debris, wire clippings, dropped components, and other foreign material.

Dropped component between mounted parts, with the surrounding pads and detection box

More from this page

Solder ball on a pad beside a mounted component
Foreign material beside an IC, with neighboring pins and the detection box
Loose component across neighboring parts, with its detection box
Small fragment on bare laminate above a mounted component

Send us a board and we will tell you which machine it needs.

Book a demo 2D equipment 3D equipment AI AOI software