Coplanarity is fundamentally a height difference that 2D top-view cannot capture in Z; dicing chipping depth is likewise flattened by grayscale, leaving no basis to quantify.
This packaging plant's finished leads must meet coplanarity: all lead bottoms should sit within one reference plane, and any lead lifted or sunk out of spec causes solder voids at mounting. Coplanarity is fundamentally a Z-direction height difference that 2D top-view images cannot measure directly; previously only sampling on a dedicated fixture was possible, slow and never full-inspection.
At the same time, depth information for dicing chipping and corner chips is flattened by 2D grayscale, so small-but-deep chips are often missed, with crack propagation found only at later stages. The common root cause of both defects is the lack of reliable 3D height information.
DaoAI Solution
DaoAI uses 3D vision to reconstruct each device's lead-bottom height per lead, directly computing coplanarity deviation against the reference and precisely locating out-of-spec leads; the same 3D data scans dicing edges per edge, quantifying chipping length and depth so small-but-deep chips are no longer masked by grayscale. Detected defects are classified and graded by AI-ADC, with inference on the device edge to match line takt.
- 3D vision measures lead-bottom height per lead, precisely computing coplanarity deviation
- Per-edge scan of dicing chipping quantifies chip length and depth
- Full inspection of coplanarity and chipping replaces sampling fixtures
- AI-ADC grading plus edge inference match line takt
Measuring height per lead turns coplanarity from a sampling fixture into inline full inspection.
After deployment, lead coplanarity out-of-spec is fully inspected inline and pinpointed to the specific lead, misses of small-but-deep dicing chips dropped markedly, and both previously sampling-dependent defects became per-unit, per-edge quantified. Downstream failures from solder voids and crack propagation fell accordingly, and quality data became more traceable.