Micro-bump arrays are dense and tiny; 2D grayscale easily misreads plating glare as bridging and lets under-height bumps pass as normal.
At this advanced packaging plant, micro-bump pitch has entered the micron level in dense arrays. Bump missing, bridging (adjacent bumps merging), and under-height directly determine downstream interconnect reliability. With 2D grayscale alone, plating glare is often misjudged as bridging, while a collapsed-height bump looks almost identical to a normal one from above, raising the miss risk.
Once such defects escape, they surface only after die-stacking and bonding, multiplying rework cost. To suppress misses, traditional 2D AOI could only tighten thresholds, which pushed overkill up, a genuine dilemma.
DaoAI Solution
DaoAI deployed the 3D AI-AOI inspection device, reconstructing each bump's height and volume from micron-level 3D topography: a missing bump reads zero height, bridging shows merged adjacent profiles, and under-height falls below the set baseline. All are clearly judged on 3D data rather than glare-prone grayscale. AI-ADC further classifies detected defects, with rare morphologies supplemented by APDT positive-sample learning.
- 3D AI-AOI captures micron-level height to judge bump missing and bridging directly
- 3D topography replaces 2D grayscale, avoiding plating-glare false alarms
- Under-height and coplanarity anomalies quantified together
- AI-ADC classifies defects; rare morphologies filled by APDT positive-sample learning
Judging bumps by height not grayscale turns missing and bridging from 'does it look like it' into 'is it measured right'.
After deployment, detection of bump missing and bridging improved markedly, false alarms from plating glare dropped sharply, and the overkill-versus-miss dilemma was broken by 3D quantification. Defects are intercepted at the bump step rather than surfacing after die stacking, visibly narrowing rework loss.